Cold Sintering Process of Composites: Bridging the Processing Temperature Gap of Ceramic and Polymer Materials

Guo, Jing; Berbano, Seth S.; Guo, Hanzheng; Baker, Amanda L.; Lanagan, Michael T.; Randall, Clive A.

doi:10.1002/adfm.201602489

Cold Sintering Process of Composites: Bridging the Processing Temperature Gap of Ceramic and Polymer Materials

Journal Article · Thu Aug 18 00:00:00 EDT 2016 · Advanced Functional Materials

DOI:https://doi.org/10.1002/adfm.201602489· OSTI ID:1533010

Guo, Jing ^[1]; Berbano, Seth S. ^[2]; Guo, Hanzheng ^[2]; Baker, Amanda L. ^[2]; Lanagan, Michael T. ^[2]; Randall, Clive A. ^[2]

Pennsylvania State Univ., University Park, PA (United States); DOE/OSTI
Pennsylvania State Univ., University Park, PA (United States)

Co-sintering ceramic and thermoplastic polymer composites in a single step with very high volume fractions of ceramics seems unlikely, given the vast differences in the typical sintering temperatures of ceramics versus polymers. These processing limitations are overcome with the introduction of a new sintering approach, namely “cold sintering process” (CSP). CSP utilizes a transient low temperature solvent, such as water or water with dissolved solutes in stoichiometric ratios consistent with the ceramic composition, to control the dissolution and precipitation of ceramics and effect densification between room temperature and ≈200 °C. Under these conditions, thermoplastic polymers and ceramic materials can be jointly formed into dense composites. Three diphasic composite examples are demonstrated to show the overall diversity of composite material design between organic and inorganic oxides, including the microwave dielectric Li₂MoO₄–(-C₂F₄-) _n, electrolyte Li_1.5Al_0.5Ge_1.5(PO₄)₃–(-CH₂CF₂-) _x [-CF2CF(CF3)-] y, and semiconductor V₂O₅–poly(3,4-ethylenedioxythiophene) polystyrene sulfonate composites. Cold sintering is more general and shall have a major impact on the processing of composite materials for many different applications, mechanical, thermal, and electronic, to mention a few possibilities. CSP concepts open up new composite material design and device integration schemes, impacting a wide variety of applications.

View Accepted Manuscript (DOE)

Research Organization:: Pennsylvania State Univ., University Park, PA (United States)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE)

Grant/Contract Number:: EE0005575

OSTI ID:: 1533010

Journal Information:: Advanced Functional Materials, Journal Name: Advanced Functional Materials Journal Issue: 39 Vol. 26; ISSN 1616-301X

Publisher:: WileyCopyright Statement

Country of Publication:: United States

Language:: English

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36 MATERIALS SCIENCE
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