On-package multiprocessor ground-referenced single-ended interconnect
A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a second processor chip, and an MCM package configured to include the first processor chip, the second processor chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first GRS interface circuit to the interconnect circuit. The second processor chip is configured to include a second GRS interface circuit. A second set of electrical traces fabricated within the MCM package and configured to coupled the second GRS interface circuit to the interconnect circuit.
- Research Organization:
- NVIDIA Corp., Santa Clara, CA (United States)
- Sponsoring Organization:
- USDOE
- Assignee:
- NVIDIA Corporation (Santa Clara, CA)
- Patent Number(s):
- 8,854,123
- Application Number:
- 13/946,980
- OSTI ID:
- 1532127
- Country of Publication:
- United States
- Language:
- English
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