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Title: On-package multiprocessor ground-referenced single-ended interconnect

Patent ·
OSTI ID:1532127

A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a second processor chip, and an MCM package configured to include the first processor chip, the second processor chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first GRS interface circuit to the interconnect circuit. The second processor chip is configured to include a second GRS interface circuit. A second set of electrical traces fabricated within the MCM package and configured to coupled the second GRS interface circuit to the interconnect circuit.

Research Organization:
NVIDIA Corp., Santa Clara, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
B599861
Assignee:
NVIDIA Corporation (Santa Clara, CA)
Patent Number(s):
8,854,123
Application Number:
13/946,980
OSTI ID:
1532127
Resource Relation:
Patent File Date: 2013-07-19
Country of Publication:
United States
Language:
English

References (3)


Cited By (8)

Ground referenced single-ended signaling patent June 2015
Ground-referenced single-ended memory interconnect patent September 2015
Ground-referenced single-ended system-on-package patent October 2015
Ground-referenced single-ended signaling connected graphics processing unit multi-chip module patent October 2015
Multi-phase ground-referenced single-ended signaling patent July 2015
Data-driven charge-pump transmitter for differential signaling patent May 2016
Ground-referenced single-ended memory interconnect patent October 2015
Ground-referenced single-ended signaling connected graphics processing unit multi-chip module patent October 2015