Ground-referenced single-ended signaling connected graphics processing unit multi-chip module
Patent
·
OSTI ID:1532138
A system of interconnected chips comprising a multi-chip module (MCM) includes a processor chip, a system functions chip, and an MCM package configured to include the processor chip, the system functions chip, and an interconnect circuit. The processor chip is configured to include a first ground-referenced single-ended signaling interface circuit. A first set of electrical traces manufactured within the MCM package and configured to couple the first single-ended signaling interface circuit to the interconnect circuit. The system functions chip is configured to include a second single-ended signaling interface circuit and a host interface. A second set of electrical traces manufactured within the MCM package and configured to couple the host interface to at least one external pin of the MCM package. In one embodiment, each single-ended signaling interface advantageously implements ground-referenced single-ended signaling.
- Research Organization:
- NVIDIA Corp., Santa Clara, CA (United States)
- Sponsoring Organization:
- USDOE
- Assignee:
- NVIDIA Corporation (Santa Clara, CA)
- Patent Number(s):
- 9,170,980
- Application Number:
- 13/973,952
- OSTI ID:
- 1532138
- Country of Publication:
- United States
- Language:
- English
Similar Records
Ground-referenced single-ended signaling connected graphics processing unit multi-chip module
On-package multiprocessor ground-referenced single-ended interconnect
Ground-referenced single-ended system-on-package
Patent
·
Tue Oct 06 00:00:00 EDT 2015
·
OSTI ID:1531817
On-package multiprocessor ground-referenced single-ended interconnect
Patent
·
Tue Oct 07 00:00:00 EDT 2014
·
OSTI ID:1532127
Ground-referenced single-ended system-on-package
Patent
·
Tue Oct 27 00:00:00 EDT 2015
·
OSTI ID:1532139