Method for determining defect depth using thermal imaging
A method and apparatus are provided for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products. A pair of flash lamps is positioned at a first side of the sample. An infrared camera is positioned near the first side of the sample. A data acquisition and processing computer is coupled to the flash lamps for triggering the flash lamps. The data acquisition and processing computer is coupled to the infrared camera for acquiring and processing thermal image data. The thermal image data are processed using a theoretical solution to analyze the thermal image data to determine the thickness of a sample and defect depth.
- Research Organization:
- Univ. of Chicago, Chicago, IL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- W-31109-ENG-38
- Assignee:
- The University of Chicago (Chicago, IL)
- Patent Number(s):
- 6,542,849
- Application Number:
- 09/766,214
- OSTI ID:
- 1531452
- Country of Publication:
- United States
- Language:
- English
Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
|
journal | September 1961 |
Early-Time Pulse-Echo Thermal Wave Imaging
|
book | January 1996 |
Pulse phase infrared thermography
|
journal | March 1996 |
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