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Title: Method for determining defect depth using thermal imaging

Patent ·
OSTI ID:1531452

A method and apparatus are provided for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products. A pair of flash lamps is positioned at a first side of the sample. An infrared camera is positioned near the first side of the sample. A data acquisition and processing computer is coupled to the flash lamps for triggering the flash lamps. The data acquisition and processing computer is coupled to the infrared camera for acquiring and processing thermal image data. The thermal image data are processed using a theoretical solution to analyze the thermal image data to determine the thickness of a sample and defect depth.

Research Organization:
Univ. of Chicago, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
W-31-109-ENG-38
Assignee:
The University of Chicago (Chicago, IL)
Patent Number(s):
6,542,849
Application Number:
09/766,214
OSTI ID:
1531452
Resource Relation:
Patent File Date: 2001-01-19
Country of Publication:
United States
Language:
English

References (7)

Automated real-time detection of defects during machining of ceramics patent November 1997
Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity journal September 1961
Pulse phase infrared thermography journal March 1996
Nondestructive testing: transient depth thermography patent January 1998
Optical method and apparatus for detection of defects and microstructural changes in ceramics and ceramic coatings patent September 2001
Early-Time Pulse-Echo Thermal Wave Imaging book January 1996
Crack sizing patent May 1989

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