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Title: Method and apparatus for detecting normal cracks using infrared thermal imaging

Abstract

A method and infrared thermal imaging apparatus detects normal and angled cracks on or beneath a sample surface using infrared thermal imaging where the crack plane is perpendicular or angled to an imaged surface of the sample. A constant heating source is used for heating a section of the sample to produce a lateral heat transfer through the sample. An infrared camera is positioned near one side of the sample for receiving thermal image data resulting from the lateral heat transfer through the sample. A data acquisition and processing computer is used for acquiring and differentiation processing thermal image data from the infrared camera for generating two-dimensional first derivative and second derivative images to detect the normal and angled cracks.

Inventors:
;
Publication Date:
Research Org.:
Univ. of Chicago, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531475
Patent Number(s):
6,730,912
Application Number:
10/232,176
Assignee:
The University of Chicago (Chicago, IL)
DOE Contract Number:  
W-31-109-ENG-38
Resource Type:
Patent
Resource Relation:
Patent File Date: 2002-08-30
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION

Citation Formats

Sun, Jiangang G., and Erdman, Scott M. Method and apparatus for detecting normal cracks using infrared thermal imaging. United States: N. p., 2004. Web.
Sun, Jiangang G., & Erdman, Scott M. Method and apparatus for detecting normal cracks using infrared thermal imaging. United States.
Sun, Jiangang G., and Erdman, Scott M. Tue . "Method and apparatus for detecting normal cracks using infrared thermal imaging". United States. https://www.osti.gov/servlets/purl/1531475.
@article{osti_1531475,
title = {Method and apparatus for detecting normal cracks using infrared thermal imaging},
author = {Sun, Jiangang G. and Erdman, Scott M.},
abstractNote = {A method and infrared thermal imaging apparatus detects normal and angled cracks on or beneath a sample surface using infrared thermal imaging where the crack plane is perpendicular or angled to an imaged surface of the sample. A constant heating source is used for heating a section of the sample to produce a lateral heat transfer through the sample. An infrared camera is positioned near one side of the sample for receiving thermal image data resulting from the lateral heat transfer through the sample. A data acquisition and processing computer is used for acquiring and differentiation processing thermal image data from the infrared camera for generating two-dimensional first derivative and second derivative images to detect the normal and angled cracks.},
doi = {},
url = {https://www.osti.gov/biblio/1531475}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {5}
}

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