Sustaining Moore's Law with 3D Chips.

Conference · 01 July 2017

DOI:https://doi.org/10.1109/MC.2017.3001236· OSTI ID:1506585

Debenedictis, Erik; Badaroglu, Mustafa ^[1]; Chen, An ^[2]; Conte, Thomas M. ^[3]; Gargini, Paolo ^[4]

Abstract not provided.

Research Organization:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Resource Relation:: Journal Volume: 50; Journal Issue: 8; Conference: Proposed for presentation at the IRDS BC Albuquerque Meeting held July 6-7, 2017 in Albuquerque, NM.

Cited By (3)

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches Cheng, Xu; Zhang, Yihui Advanced Materials, Vol. 31, Issue 36 https://doi.org/10.1002/adma.201901895	journal	June 2019
Ultra-thin chips for high-performance flexible electronics Gupta, Shoubhik; Navaraj, William Taube; Lorenzelli, Leandro npj Flexible Electronics, Vol. 2, Issue 1 https://doi.org/10.1038/s41528-018-0021-5	journal	March 2018
Metrology for the next generation of semiconductor devices Orji, N. G.; Badaroglu, M.; Barnes, B. M. Nature Electronics, Vol. 1, Issue 10 https://doi.org/10.1038/s41928-018-0150-9	journal	October 2018

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