Sustaining Moore's Law with 3D Chips.

Conference · Sat Jul 01 04:00:00 EDT 2017

DOI:https://doi.org/10.1109/MC.2017.3001236· OSTI ID:1506585

Debenedictis, Erik; Badaroglu, Mustafa ^[1]; Chen, An ^[2]; Conte, Thomas M. ^[3]; Gargini, Paolo ^[4]

Abstract not provided.

Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Cited By (3)

Metrology for the next generation of semiconductor devices Orji, N. G.; Badaroglu, M.; Barnes, B. M. Nature Electronics, Vol. 1, Issue 10 https://doi.org/10.1038/s41928-018-0150-9	journal	October 2018
Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches Cheng, Xu; Zhang, Yihui Advanced Materials, Vol. 31, Issue 36 https://doi.org/10.1002/adma.201901895	journal	June 2019
Ultra-thin chips for high-performance flexible electronics Gupta, Shoubhik; Navaraj, William Taube; Lorenzelli, Leandro npj Flexible Electronics, Vol. 2, Issue 1 https://doi.org/10.1038/s41528-018-0021-5	journal	March 2018

Sustaining Moore's law with 3D chips

Journal Article · Mon Jul 31 20:00:00 EDT 2017 · Computer · OSTI ID:1389592

Moore's Law.

Conference · Fri Oct 01 00:00:00 EDT 2010 · OSTI ID:1121670

What's Beyond Moore's Law?.

Conference · Sun Jun 01 00:00:00 EDT 2008 · OSTI ID:1706574