Sustaining Moore's law with 3D chips
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Qualcomm, San Diego, CA (United States)
- Semiconductor Research Corp. (SRC), Durham, NC (United States)
- Georgia Inst. of Technology, Atlanta, GA (United States)
- International Roadmap for Devices and Systems
Here, rather than continue the expensive and time-consuming quest for transistor replacement, the authors argue that 3D chips coupled with new computer architectures can keep Moore's law on its traditional scaling path.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- Grant/Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1389592
- Alternate ID(s):
- OSTI ID: 1506585
- Report Number(s):
- SAND--2017-9177J; 656561
- Journal Information:
- Computer, Journal Name: Computer Journal Issue: 8 Vol. 50; ISSN 0018-9162
- Publisher:
- IEEECopyright Statement
- Country of Publication:
- United States
- Language:
- English
Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches
|
journal | June 2019 |
Ultra-thin chips for high-performance flexible electronics
|
journal | March 2018 |
Metrology for the next generation of semiconductor devices
|
journal | October 2018 |
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