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Title: Sustaining Moore's Law with 3D Chips.

Conference ·

Abstract not provided.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1506585
Report Number(s):
SAND2017-7069C; 655057
Resource Relation:
Journal Volume: 50; Journal Issue: 8; Conference: Proposed for presentation at the IRDS BC Albuquerque Meeting held July 6-7, 2017 in Albuquerque, NM.
Country of Publication:
United States
Language:
English

Cited By (3)

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches journal June 2019
Ultra-thin chips for high-performance flexible electronics journal March 2018
Metrology for the next generation of semiconductor devices journal October 2018

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