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Title: Controlling the formation and stability of ultra-thin nickel silicides - An alloying strategy for preventing agglomeration

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.5009641· OSTI ID:1499543

The electrical contact of the source and drain regions in state-of-the-art CMOS transistors is nowadays facilitated through NiSi, which is often alloyed with Pt in order to avoid morphological agglomeration of the silicide film. However, the solid-state reaction between as-deposited Ni and the Si substrate exhibits a peculiar change for as-deposited Ni films thinner than a critical thickness of tc = 5 nm. Whereas thicker films form polycrystalline NiSi upon annealing above 450 °C , thinner films form epitaxial NiSi2 films that exhibit a high resistance toward agglomeration. For industrial applications, it is therefore of utmost importance to assess the critical thickness with high certainty and find novel methodologies to either increase or decrease its value, depending on the aimed silicide formation. This paper investigates Ni films between 0 and 15 nm initial thickness by use of “thickness gradients,” which provide semi-continuous information on silicide formation and stability as a function of as-deposited layer thickness. The alloying of these Ni layers with 10% Al, Co, Ge, Pd, or Pt renders a significant change in the phase sequence as a function of thickness and dependent on the alloying element. The addition of these ternary impurities therefore changes the critical thickness tc. Furthermore, the results are discussed in the framework of classical nucleation theory.

Research Organization:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities Division
Grant/Contract Number:
AC02-98CH10886; SC0012704
OSTI ID:
1499543
Alternate ID(s):
OSTI ID: 1422009
Report Number(s):
BNL-209547-2018-JACI
Journal Information:
Journal of Applied Physics, Vol. 123, Issue 7; ISSN 0021-8979
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 22 works
Citation information provided by
Web of Science

References (44)

20nm Gate length Schottky MOSFETs with ultra-thin NiSi/epitaxial NiSi2 source/drain journal May 2012
Influence of Al on the growth of NiSi2 on Si(001) journal December 2005
Ge effects on silicidation journal December 2005
Silicide formation during reaction between Ni ultra-thin films and Si(001) substrates journal February 2014
Effect of Ti alloying in nickel silicide formation journal May 2006
High-temperature degradation of NiSi films: Agglomeration versus NiSi2 nucleation journal August 2005
The Al–Ni–Si phase diagram. Part II journal May 2004
Direct observation of NiSi lateral growth at the epitaxial θ-Ni2Si/Si(1 0 0) interface journal October 2015
Exploitation of a self-limiting process for reproducible formation of ultrathin Ni1−xPtx silicide films journal December 2010
First stages of Pd/Ge reaction: Mixing effects and dominant diffusing species journal January 2017
Phase formation and film morphology of ultrathin Co 1− x Ni x Si 2 films journal September 2012
Ultrathin Ni Silicides With Low Contact Resistance on Strained and Unstrained Silicon journal April 2010
Extensive Raman spectroscopic investigation of ultrathin Co 1−x Ni x Si 2 films grown on Si(100) journal July 2012
Enhancement of thermal stability of NiSi films on (100)Si and (111)Si by Pt addition journal September 1999
Formation and stability of NiSi in the presence of Co and Fe alloying elements
  • Deduytsche, D.; Detavernier, C.; Van Meirhaeghe, R. L.
  • Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 26, Issue 6 https://doi.org/10.1116/1.3010719
journal November 2008
Texture of NiSi films on Si(001), (111), and (110) substrates journal June 2008
On the thermal expansion coefficient of CoSi 2 and NiSi 2 journal November 2009
Formation and morphological stability of NiSi in the presence of W, Ti, and Ta alloying elements journal February 2007
Ternary silicide formation from Ni-Pt, Ni-Pd and Pt-Pd alloys on Si(100): Nucleation and solid solubility of the monosilicides journal May 2017
Silicides and germanides for nano-CMOS applications journal December 2008
Silicides for the 100-nm node and beyond: Co-silicide, Co(Ni)-silicide and Ni-silicide journal October 2002
Phase formation and thermal stability of ultrathin nickel-silicides on Si(100) journal April 2010
The role of composition and microstructure in Ni–W silicide formation and low temperature epitaxial NiSi 2 growth by premixing Si journal January 2017
Interactions in the Co–Ni–Si system at 800°C journal February 2000
Towards implementation of a nickel silicide process for CMOS technologies journal November 2003
Thermodynamics of solid transition-metal silicides journal June 1990
Morphological stability and specific resistivity of sub-10 nm silicide films of Ni1−xPtx on Si substrate journal February 2010
Enhanced Detection Sensitivity with a New Windowless XEDS System for AEM Based on Silicon Drift Detector Technology journal July 2010
Metastable phase formation during the reaction of Ni films with Si(001): The role of texture inheritance journal May 2010
Epitaxial silicides journal July 1982
Ni based silicides for 45nm CMOS and beyond journal December 2004
On the growth kinetics of Ni(Pt) silicide thin films journal April 2013
Epitaxy of Ultrathin NiSi2 Films with Predetermined Thickness journal January 2011
Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films journal November 2006
Visualization and classification of epitaxial alignment at hetero-phase boundaries journal January 2016
Influence of mixing entropy on the nucleation of CoSi 2 journal November 2000
Study of nickel silicide contact on Si/Si 1-x Ge x journal September 2003
Surface-energy triggered phase formation and epitaxy in nanometer-thick Ni1−xPtx silicide films journal January 2010
Precise determination of lattice parameter and thermal expansion coefficient of silicon between 300 and 1500 K journal July 1984
Texture in thin film silicides and germanides: A review journal September 2016
Challenges of nickel silicidation in CMOS technologies journal April 2015
Nucleation and diffusion during growth of ternary Co1−xNixSi2 thin films studied by complementary techniques in real time journal November 2008
Effect of alloying elements Mo and W on Ni silicides formation journal May 2014
Epitaxial Silicides journal January 1981

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Impurity-enhanced solid-state amorphization: the Ni–Si thin film reaction altered by nitrogen journal February 2019

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