A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology

Vianco, Paul T.

doi:10.1007/s11837-018-3219-z

A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology

Journal Article · Wed Nov 14 23:00:00 EST 2018 · JOM. Journal of the Minerals, Metals & Materials Society

DOI:https://doi.org/10.1007/s11837-018-3219-z· OSTI ID:1487428

Vianco, Paul T. ^[1]

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Here, this report examines the role of interfaces in electronic packaging applications with the focus placed on soldering technology. Materials and processes are described with respect to their roles on the performance and reliability of associated interfaces. The discussion will also include interface microstructures created by coatings and finishes that are frequently used in packaging applications. Numerous examples are cited to illustrate the importance of interfaces in physical and mechanical metallurgy as well as the engineering function of interconnections. Regardless of the specific application, interfaces are non-equilibrium structures, which has important ramifications for the long-term reliability of electronic packaging.

View Accepted Manuscript (DOE)

Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: AC04-94AL85000

OSTI ID:: 1487428

Report Number(s):: SAND--2018-6973J; 665166

Journal Information:: JOM. Journal of the Minerals, Metals & Materials Society, Journal Name: JOM. Journal of the Minerals, Metals & Materials Society Journal Issue: 1 Vol. 71; ISSN 1047-4838

Publisher:: SpringerCopyright Statement

Country of Publication:: United States

Language:: English

References (14)

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Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings Vianco, Paul T.; Hlava, Paul F.; Kilgo, Alice C. Journal of Electronic Materials, Vol. 23, Issue 7 https://doi.org/10.1007/BF02653343	journal	July 1994
Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper Vianco, P. T.; Kilgo, A. C.; Grant, R. Journal of Electronic Materials, Vol. 24, Issue 10 https://doi.org/10.1007/BF02655468	journal	October 1995
Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy Vianco, Paul T.; Rejent, Jerome A.; Zender, Gary L. Metallurgical and Materials Transactions A, Vol. 41, Issue 12 https://doi.org/10.1007/s11661-010-0406-0	journal	September 2010
A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique Choi, W. K.; Kang, S. K.; Shih, D. -Y. Journal of Electronic Materials, Vol. 31, Issue 11 https://doi.org/10.1007/s11664-002-0022-x	journal	November 2002
Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder Vianco, Paul T.; Rejent, Jerome A.; Hlava, Paul F. Journal of Electronic Materials, Vol. 33, Issue 9 https://doi.org/10.1007/s11664-004-0026-9	journal	September 2004
Modeling the solid-state reaction between Sn-Pb solder and a porous substrate coating Erickson, K. L.; Hopkins, P. L.; Vianco, P. T. Journal of Electronic Materials, Vol. 27, Issue 11 https://doi.org/10.1007/s11664-998-0067-6	journal	November 1998
Surface and interface stress effects on interfacial and nanostructured materials Cammarata, R. C. Materials Science and Engineering: A, Vol. 237, Issue 2 https://doi.org/10.1016/S0921-5093(97)00128-7	journal	September 1997
The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering Chang, C. C.; Lin, Y. W.; Wang, Y. W. Journal of Alloys and Compounds, Vol. 492, Issue 1-2 https://doi.org/10.1016/j.jallcom.2009.11.088	journal	March 2010
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References (14)

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