Microstructural characterization of Cu-Sn-Ni solder in microelectronic packaging
- National Tsing Hua Univ., Hsinchu (Taiwan, Province of China)
Microelectronic packaging has experienced exciting growth in the past years, and solder joints plays important roles in the reliability of package system. Lead-tin (Pb-Sn) alloys are the most prominant solders for the interconnection and packaging of modern electronic components and devices. However, there are environmental concern on the toxicity of Pb. These concerns have inspired a great deal of research to study the feasibility of lead-free replacement alloys. It is known that the presence of intermetallic growth may be detrimental to joint reliability. The purpose of this study is to investigate the growth evolution between unleaded Cu-Sn-Ni alloys and metallized layer. These results will help to characterize the effect of aging on the microstructural and mechanical properties of solder/metallized/substrate systems.
- OSTI ID:
- 468852
- Report Number(s):
- CONF-960877--
- Country of Publication:
- United States
- Language:
- English
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