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Suppression of side-etching in C{sub 2}H{sub 6}/H{sub 2}/O{sub 2} reactive ion etching for the fabrication of an InGaAsP/InP P-substrate buried-heterostructure laser diode

Journal Article · · Journal of the Electrochemical Society
DOI:https://doi.org/10.1149/1.2221136· OSTI ID:142192
;  [1]; ; ; ; ;  [2]
  1. Mitsubishi Electric Corp., Amagasaki, Hyogo (Japan). Central Research Lab.
  2. Mitsubishi Electric Corp., Itami, Hyogo (Japan). Optoelectronic and Microwave Device Lab.
A reactive ion etching (RIE) technique using a C{sub 2}H{sub 6}, H{sub 2}, and O{sub 2} mixture was applied to the fabrication of InGaAsP/InP (P-substrate) partially inverted buried heterostructure laser diodes, which have been commercially produced for their superior characteristics. The addition of O{sub 2} suppressed side etching and made it possible to fabricate ridge mesa structures for the laser diodes with a height of 4 {mu}m and a width of 1{mu}m with superior controllability. The effects of O{sub 2} addition were investigated by Auger electron spectroscopy and a mechanism suppressing side etching was examined. The characteristics including lifetime of the laser diodes fabricated by the RIE technique were as excellent as those of laser diodes fabricated by wet etching.
Sponsoring Organization:
USDOE
OSTI ID:
142192
Journal Information:
Journal of the Electrochemical Society, Journal Name: Journal of the Electrochemical Society Journal Issue: 12 Vol. 140; ISSN JESOAN; ISSN 0013-4651
Country of Publication:
United States
Language:
English