Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface

Ma, Qiang; Zaera, Francisco

doi:10.1116/1.4896940

Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface

Journal Article · Thu Jan 01 00:00:00 EST 2015 · Journal of Vacuum Science and Technology A

DOI:https://doi.org/10.1116/1.4896940· OSTI ID:1420484

Ma, Qiang ^[1]; Zaera, Francisco ^[1]

Department of Chemistry, University of California, Riverside, California 92521

Not Available

View Accepted Manuscript (Publisher)

Sponsoring Organization:: USDOE

Grant/Contract Number:: SC0001839

OSTI ID:: 1420484

Alternate ID(s):: OSTI ID: 22318079

Journal Information:: Journal of Vacuum Science and Technology A, Journal Name: Journal of Vacuum Science and Technology A Journal Issue: 1 Vol. 33; ISSN 0734-2101

Publisher:: American Vacuum SocietyCopyright Statement

Country of Publication:: United States

Language:: English

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