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Thermal chemistry of copper acetamidinate atomic layer deposition precursors on silicon oxide surfaces studied by XPS

Journal Article · · Journal of Vacuum Science and Technology A
DOI:https://doi.org/10.1116/1.4927843· OSTI ID:1421135
 [1];  [1]
  1. Department of Chemistry, University of California, Riverside, California 92521
Not Available
Sponsoring Organization:
USDOE
Grant/Contract Number:
SC0001839
OSTI ID:
1421135
Alternate ID(s):
OSTI ID: 22489735
Journal Information:
Journal of Vacuum Science and Technology A, Journal Name: Journal of Vacuum Science and Technology A Journal Issue: 1 Vol. 34; ISSN 0734-2101; ISSN JVTAD6
Publisher:
American Vacuum SocietyCopyright Statement
Country of Publication:
United States
Language:
English

References (26)

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Multilevel interconnections for ULSI and GSI era journal May 1997
Amidinates, guanidinates and iminopyrrolidinates: Understanding precursor thermolysis to design a better ligand journal December 2013
Precursors and chemistry for the atomic layer deposition of metallic first row transition metal films journal December 2013
Precursor design and reaction mechanisms for the atomic layer deposition of metal films journal December 2013
Mechanisms of surface reactions in thin solid film chemical deposition processes journal December 2013
Surface Chemistry of Copper(I) Acetamidinates in Connection with Atomic Layer Deposition (ALD) Processes journal July 2011
Thermal Chemistry of Cu(I)-Iminopyrrolidinate and Cu(I)-Guanidinate Atomic Layer Deposition (ALD) Precursors on Ni(110) Single-Crystal Surfaces journal August 2013
Uptake of Copper Acetamidinate ALD Precursors on Nickel Surfaces journal January 2010
Atomic Layer Deposition: An Overview journal January 2010
Synthesis and Characterization of Copper(I) Amidinates as Precursors for Atomic Layer Deposition (ALD) of Copper Metal journal March 2005
X-ray-Initiated Metal-Promoted Thin Film Growth journal April 2012
The Surface Chemistry of Atomic Layer Depositions of Solid Thin Films journal May 2012
Surface and Interface Processes during Atomic Layer Deposition of Copper on Silicon Oxide journal March 2010
Atomic layer deposition of transition metals journal October 2003
SiO2 film thickness metrology by x-ray photoelectron spectroscopy journal November 1997
Spatial resolution in thin film deposition on silicon surfaces by combining silylation and UV/ozonolysis journal November 2014
Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing journal January 2003
Thermal chemistry of copper(I)- N,N ′ -di- sec -butylacetamidinate on Cu(110) single-crystal surfaces
  • Ma, Qiang; Zaera, Francisco; Gordon, Roy G.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 30, Issue 1 https://doi.org/10.1116/1.3658381
journal January 2012
Chemistry of Cu(acac) 2 on Ni(110) and Cu(110) surfaces: Implications for atomic layer deposition processes journal January 2013
A thermal desorption and x‐ray photoelectron spectroscopy study of the surface chemistry of iron pentacarbonyl journal May 1989
Copper Metallization for High Performance Silicon Technology journal August 2000
In-situ FTIR Study of Atomic Layer Deposition (ALD) of Copper Metal Films journal September 2007
Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers journal January 2011
Study on the Adhesion Strength of CVD-Cu Films with ALD-Co(W) Underlayers Made Using Amidinato Precursors journal November 2014
Recent Advances in Chemical Vapor Deposition journal June 2006

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