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Title: Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.

Abstract

Abstract not provided.

Authors:
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
OSTI Identifier:
1409913
Report Number(s):
SAND2016-11713C
649222
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the FABTECH held November 16-18, 2016 in Las Vegas, NV.
Country of Publication:
United States
Language:
English

Citation Formats

Vianco, Paul T. Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.. United States: N. p., 2016. Web.
Vianco, Paul T. Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.. United States.
Vianco, Paul T. Tue . "Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.". United States. https://www.osti.gov/servlets/purl/1409913.
@article{osti_1409913,
title = {Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.},
author = {Vianco, Paul T.},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {11}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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