Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.
                            Conference
                            ·
                            
                            
                            
                    
                                
                                OSTI ID:1248708
                                
                            
                        Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1248708
- Report Number(s):
- SAND2015-2862C; 583184
- Country of Publication:
- United States
- Language:
- English
Similar Records
                                
                                
                                    
                                        
                                        Reliability Analysis of Pin-in-Hole Solder Joints by Computational Modeling.
                                        
Modeling the Aging and Reliability of Solder Joints.
Metallurgical Analysis of Pin-to-Flex Circuit Solder Joints.
                        
                                            Conference
                                            ·
                                            Wed Apr 01 00:00:00 EDT 2015
                                            
                                            ·
                                            OSTI ID:1247091
                                        
                                        
                                        
                                    
                                
                                    
                                        Modeling the Aging and Reliability of Solder Joints.
                                            Conference
                                            ·
                                            Wed Jul 01 00:00:00 EDT 2009
                                            
                                            ·
                                            OSTI ID:1142136
                                        
                                        
                                        
                                    
                                
                                    
                                        Metallurgical Analysis of Pin-to-Flex Circuit Solder Joints.
                                            Conference
                                            ·
                                            Tue Aug 01 00:00:00 EDT 2017
                                            
                                            ·
                                            OSTI ID:1468708