Laser patterning of laminated structures for electroplating
Patent
·
OSTI ID:140711
A process for laser patterning of a substrate so that it can be subsequently electroplated or electrolessly plated. The process utilizes a laser to treat an inactive (inert) layer formed over an active layer to either combine or remove the inactive layer to produce a patterned active layer on which electrodeposition can occur. The process is carried out by utilizing laser alloying and laser etching, and involves only a few relatively high yield steps and can be performed on a very small scale. 9 figures.
- Research Organization:
- University of California
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- USDOE, Washington, DC (United States)
- Patent Number(s):
- US 5,264,108/A/
- OSTI ID:
- 140711
- Country of Publication:
- United States
- Language:
- English
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