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Microfabrication of plastic-PDMS microfluidic devices using polyimide release layer and selective adhesive bonding

Journal Article · · Journal of Micromechanics and Microengineering. Structures, Devices and Systems
 [1];  [2];  [3];  [2]
  1. Stony Brook Univ., NY (United States)
  2. Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)
  3. Brookhaven National Lab. (BNL), Upton, NY (United States)
+ Show Author Affiliations
In this study, we present an improved method to bond poly(dimethylsiloxane) (PDMS) with polyimide (PI) to develop flexible substrate microfluidic devices. The PI film was separately fabricated on a silicon wafer by spin coating followed by thermal treatment to avoid surface unevenness of the flexible substrate. In this way, we could also integrate flexible substrate into standard micro-electromechanical systems (MEMS) fabrication. Meanwhile, the adhesive epoxy was selectively transferred to the PDMS microfluidic device by a stamp-and-stick method to avoid epoxy clogging the microfluidic channels. To spread out the epoxy evenly on the transferring substrate, we used superhydrophilic vanadium oxide film coated glass as the transferring substrate. After the bonding process, the flexible substrate could easily be peeled off from the rigid substrate. Contact angle measurement was used to characterize the hydrophicity of the vanadium oxide film. X-ray photoelectron spectroscopy analysis was conducted to study the surface of the epoxy. We further evaluated the bonding quality by peeling tests, which showed a maximum bonding strength of 100 kPa. By injecting with black ink, the plastic microfluidic device was confirmed to be well bonded with no leakage for a day under 1 atm. Finally, this proposed versatile method could bond the microfluidic device and plastic substrate together and be applied in the fabrication of some biosensors and lab-on-a-chip systems.
Research Organization:
Brookhaven National Lab. (BNL), Upton, NY (United States); Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)
Sponsoring Organization:
AbbVie Inc. (United States); National Science Foundation (NSF) (United States); USDOE Office of Science (SC)
Grant/Contract Number:
SC0012704
OSTI ID:
1392268
Alternate ID(s):
OSTI ID: 22665245
Report Number(s):
BNL--114324-2017-JA; KC0403020
Journal Information:
Journal of Micromechanics and Microengineering. Structures, Devices and Systems, Journal Name: Journal of Micromechanics and Microengineering. Structures, Devices and Systems Journal Issue: 5 Vol. 27; ISSN 0960-1317
Publisher:
IOP PublishingCopyright Statement
Country of Publication:
United States
Language:
English

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Poly(dimethylsiloxane)-polyimide blends in the formation of thick polyimide films journal December 2006
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Selective stamp bonding of PDMS microfluidic devices to polymer substrates for biological applications journal April 2013
Poly(pyrrole) microwires fabrication process on flexible thermoplastics polymers: Application as a biosensing material journal December 2015
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A facile route for irreversible bonding of plastic-PDMS hybrid microdevices at room temperature journal January 2010
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Micro-differential scanning calorimeter for liquid biological samples journal October 2016
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  • Ahmed, Moinuddin; Butler, Donald P.
  • Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 31, Issue 5 https://doi.org/10.1116/1.4816938
journal September 2013
WEAR BEHAVIOR OF NANOSTRUCTURED HYPOEUTECTIC Fe–B ALLOY journal January 2017

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Nanocalorimeters for biomolecular analysis and cell metabolism monitoring journal January 2020

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Related Subjects

42 ENGINEERING
Center for Functional Nanomaterials
adhesive bonding
flexible substrate
microfluidic device
polydimethylsiloxane (PDMS)
polyimide (PI)
stamp-and-stick
superhydrophilic