Thermodynamic Stability of Low-k Amorphous SiOCH Dielectric Films

Chen, Jiewei; King, Sean W.; Muthuswamy, Elayaraja; Koryttseva, Anastasia; Wu, Di; Navrotsky, Alexandra; Riedel, R.

doi:10.1111/jace.14268

Title: Thermodynamic Stability of Low-k Amorphous SiOCH Dielectric Films

Journal Article · Mon Apr 25 00:00:00 EDT 2016 · Journal of the American Ceramic Society

DOI:https://doi.org/10.1111/jace.14268· OSTI ID:1388521

Chen, Jiewei ^[1]; King, Sean W. ^[2]; Muthuswamy, Elayaraja ^[1]; Koryttseva, Anastasia ^[3]; Wu, Di ^[1]; Navrotsky, Alexandra ^[1]; Riedel, R.

Peter A. Rock Thermochemistry Laboratory and NEAT ORU, University of California Davis, Davis California 95616
Logic Technology Development, Intel Corporation, Hillsboro Oregon 97124
Peter A. Rock Thermochemistry Laboratory and NEAT ORU, University of California Davis, Davis California 95616; Department of Chemistry, N.I. Lobachevsky State University of Nizhny Novgorod, 23 Gagarin Avenue Nizhny Novgorod 603950 Russia

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Research Organization:: Energy Frontier Research Centers (EFRC) (United States). Fluid Interface Reactions, Structures and Transport Center (FIRST)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

DOE Contract Number:: ERKCC61

OSTI ID:: 1388521

Journal Information:: Journal of the American Ceramic Society, Vol. 99, Issue 8; Related Information: FIRST partners with Oak Ridge National Laboratory (lead); Argonne National Laboratory; Drexel University; Georgia State University; Northwestern University; Pennsylvania State University; Suffolk University; Vanderbilt University; University of Virginia; ISSN 0002-7820

Publisher:: American Ceramic Society

Country of Publication:: United States

Language:: English

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