THERMAL MECHANICAL FATIGUE OF A 56 I/O PLASTIC QUAD-FLAT NOLEAD (PQFN) PACKAGE.
Conference
·
OSTI ID:1327509
Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1327509
- Report Number(s):
- SAND2015-6357C; 606235
- Country of Publication:
- United States
- Language:
- English
Similar Records
Thermal Mechanical Fatigue of a 56 I/O Quad-Flat Nolead (QFN) Package.
Predicting Thermal Mechanical Fatigue of 63Sn37Pb Solder.
Dish Stirling High Performance Thermal Storage FY13Q1 Quad Chart .
Conference
·
Thu Oct 01 00:00:00 EDT 2015
·
OSTI ID:1331959
Predicting Thermal Mechanical Fatigue of 63Sn37Pb Solder.
Conference
·
Sat Jul 01 00:00:00 EDT 2017
·
OSTI ID:1507966
Dish Stirling High Performance Thermal Storage FY13Q1 Quad Chart .
Conference
·
Mon Dec 31 23:00:00 EST 2012
·
OSTI ID:1649865