Predicting Thermal Mechanical Fatigue of 63Sn37Pb Solder.
                            Conference
                            ·
                            
                            
                            
                    
                                
                                OSTI ID:1507966
                                
                            
                        Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1507966
- Report Number(s):
- SAND2017-7587PE; 655476
- Country of Publication:
- United States
- Language:
- English
Similar Records
                                
                                
                                    
                                        
                                        Constitutive Model Development for Predicting Thermal Mechanical Fatigue Deformation in Solder Interconnects
                                        
Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Materials
Solder Interconnect Predictor (SIP) Solder Fatigue Software.
                        
                                            Conference
                                            ·
                                            Mon Sep 18 00:00:00 EDT 2000
                                            
                                            ·
                                            OSTI ID:763110
                                        
                                        
                                        
                                    
                                
                                    
                                        Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Materials
                                            Conference
                                            ·
                                            Thu Jul 27 00:00:00 EDT 2000
                                            
                                            ·
                                            OSTI ID:761834
                                        
                                        
                                        
                                    
                                
                                    
                                        Solder Interconnect Predictor (SIP) Solder Fatigue Software.
                                            Conference
                                            ·
                                            Wed Oct 01 00:00:00 EDT 2008
                                            
                                            ·
                                            OSTI ID:1142781