Thermal characterization and properties of a copper-diamond composite

Technical Report · Mon Sep 01 04:00:00 EDT 2014

DOI:https://doi.org/10.2172/1322267· OSTI ID:1322267

Yang, Pin ^[1]; Chavez, Thomas P. ^[1]; DiAntonio, Christopher Brian ^[1]; Coker, Eric Nicholas ^[1]

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1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

The thermal properties of a commercial copper-diamond composite were measured from below -50°C to above 200°C. The results of thermal expansion, heat capacity, and thermal diffusivity were reported. These data were used to calculate the thermal conductivity of the composite as a function of temperature in the thickness direction. These results are compared with estimated values based on a simple mixing rule and the temperature dependence of these physical properties is represented by curve fitting equations. These fitting equations can be used for thermal modeling of practical devices/systems at their operation temperatures. The results of the mixing rule showed a consistent correlation between the amount of copper and diamond in the composite, based on density, thermal expansion, and heat capacity measurements. However, there was a disparity between measured and estimated thermal diffusivity and thermal conductivity. These discrepancies can be caused by many intrinsic material issues such as lattice defects and impurities, but the dominant factor is attributed to the large uncertainty of the interfacial thermal conductance between diamond and copper.

• Research Organization: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1322267
• Report Number(s): SAND2014--17329; 537089
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE