Thermal diffusivity of diamond/Si composite films measured by an ac calorimetric method. 2: Characterization of deposited diamond layers

Journal Article · Sat Mar 01 04:00:00 EST 1997 · International Journal of Thermophysics

DOI:https://doi.org/10.1007/BF02575181· OSTI ID:675538

Gu, Y Q; Yu, L X ^[1]; Hatta, I ^[2]

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1. Tsinghua Univ., Beijing (China). Dept. of Engineering Mechanics
2. Nagoya Univ. (Japan). Dept. of Applied Physics

Thermal diffusivity of diamond/Si composite films was measured in the direction parallel to the plane of the film by an ac calorimetric method. The effect of two-dimensional heat conduction on the measured results appears to be due to the difference in the thermal diffusivities of the layers. The thermal diffusivity measured by the thermocouple attached on the diamond side was higher than that on the silicon side. This might be due to the two-dimensional effects. As a result, the estimated thermal diffusivity of the diamond layer from the result of composite film detected on the diamond side is higher than that detected on the Si side. This gives rise to an error in the estimated thermal diffusivity of the diamond layer. A criterion for the deviation of the estimated thermal diffusivity is proposed.

• Sponsoring Organization: USDOE
• OSTI ID: 675538
• Report Number(s): CONF-9509483--
• Journal Information: International Journal of Thermophysics, Journal Name: International Journal of Thermophysics Journal Issue: 2 Vol. 18; ISSN 0195-928X; ISSN IJTHDY
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CALORIMETRY
COMPOSITE MATERIALS
DIAMONDS
ERRORS
SILICON
THERMAL DIFFUSIVITY