Total ionizing dose effects of Ge channel pFETs with raised Si0.55Ge0.45 source/drain
Journal Article
·
· IEEE Transactions on Nuclear Science
- Vanderbilt Univ., Nashville, TN (United States)
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Vanderbilt Univ., Nashville, TN (United States); Beijing Microelectronics Technology Institute, Beijing (China)
- IMEC, Kapeldreef, Leuven (Belgium)
The total ionizing dose response of Ge channel pFETs with raised Si0.55Ge0.45 source/drain is investigated under different radiation bias conditions. Threshold-voltage shifts and transconductance degradation are noticeable only for negative-bias (on state) irradiation, and are mainly due to negative bias-temperature instability (NBTI). Here, nonmonotonic leakage changes during irradiation are observed, which are attributed to the competition of radiation-induced field transistor leakage and S/D junction leakage.
- Research Organization:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- AC05-00OR22725
- OSTI ID:
- 1265976
- Journal Information:
- IEEE Transactions on Nuclear Science, Journal Name: IEEE Transactions on Nuclear Science Journal Issue: 6 Vol. 62; ISSN 0018-9499
- Publisher:
- Institute of Electrical and Electronics Engineers (IEEE)
- Country of Publication:
- United States
- Language:
- English
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