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Total ionizing dose effects of Ge channel pFETs with raised Si0.55Ge0.45 source/drain

Journal Article · · IEEE Transactions on Nuclear Science
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  1. Vanderbilt Univ., Nashville, TN (United States)
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  3. Vanderbilt Univ., Nashville, TN (United States); Beijing Microelectronics Technology Institute, Beijing (China)
  4. IMEC, Kapeldreef, Leuven (Belgium)

The total ionizing dose response of Ge channel pFETs with raised Si0.55Ge0.45 source/drain is investigated under different radiation bias conditions. Threshold-voltage shifts and transconductance degradation are noticeable only for negative-bias (on state) irradiation, and are mainly due to negative bias-temperature instability (NBTI). Here, nonmonotonic leakage changes during irradiation are observed, which are attributed to the competition of radiation-induced field transistor leakage and S/D junction leakage.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE Office of Science (SC)
DOE Contract Number:
AC05-00OR22725
OSTI ID:
1265976
Journal Information:
IEEE Transactions on Nuclear Science, Journal Name: IEEE Transactions on Nuclear Science Journal Issue: 6 Vol. 62; ISSN 0018-9499
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Country of Publication:
United States
Language:
English

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