Total Ionizing Dose Effects on Ge Channel $$p$$FETs with Raised $${\rm Si}_{0.55}{\rm Ge}_{0.45}$$ Source/Drain
Journal Article
·
· IEEE Transactions on Nuclear Science
- Beijing Microelectronics Technology Institute, Beijing (China)
- Vanderbilt Univ., Nashville, TN (United States)
- Imec, Leuven (Belgium)
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Here, the total ionizing dose response of Ge channel pFETs with raised Si0.55Ge0.45 source/drain is investigated under different radiation bias conditions. Threshold-voltage shifts and transconductance degradation are noticeable only for negative-bias (on state) irradiation, and are mainly due to negative bias-temperature instability (NBTI). Nonmonotonic leakage changes during irradiation are observed, which are attributed to the competition of radiation-induced field transistor leakage and S/D junction leakage.
- Research Organization:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- AC05-00OR22725
- OSTI ID:
- 1399555
- Journal Information:
- IEEE Transactions on Nuclear Science, Vol. 62, Issue 6; ISSN 0018-9499
- Publisher:
- IEEECopyright Statement
- Country of Publication:
- United States
- Language:
- English
Cited by: 9 works
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