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Additive manufacturing of hybrid circuits

Journal Article · · Annual Review of Materials Research

There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. As a result, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC04-94AL85000
OSTI ID:
1247661
Report Number(s):
SAND--2016-0248J; 618373
Journal Information:
Annual Review of Materials Research, Journal Name: Annual Review of Materials Research Journal Issue: 1 Vol. 46; ISSN 1531-7331
Publisher:
Annual ReviewsCopyright Statement
Country of Publication:
United States
Language:
English

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Cited By (10)

Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature text January 2019
Additive Manufacturing of Metal Structures at the Micrometer Scale journal January 2017
Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications journal January 2019
Size and surface effects on chemically-induced joining of Ag conductive inks journal January 2018
Principles of aerosol jet printing journal July 2018
Guided ink and process design for aerosol jet printing based on annular drying effects journal September 2018
Dynamics of contracting filaments journal September 2019
Influence of high temperature annealing on the dielectric properties of alumina films prepared by the aerosol deposition method journal April 2018
Bipolar Electrochemistry Regulation for Dynamic Meniscus Confined Electrodeposition of Copper Micro-Structures by a Double-Anode System journal January 2019
Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature journal February 2019

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