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Methods and systems for rapid prototyping of high density circuits

Patent ·
OSTI ID:943490
 [1];  [1];  [1];  [1];  [2];  [2]
  1. Albuquerque, NM
  2. El Paso, TX
+ Show Author Affiliations

A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM
Sponsoring Organization:
United States Department of Energy
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
7,419,630
Application Number:
10/907,979
OSTI ID:
943490
Country of Publication:
United States
Language:
English

References (10)

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Hydrogels for tissue engineering: scaffold design variables and applications journal November 2003
Hydrogels for biomedical applications journal January 2002
Materials for protein delivery in tissue engineering journal August 1998
Three-Dimensional Photopatterning of Hydrogels Containing Living Cells journal November 2002
Building around inserts: methods for fabricating complex devices in stereolithography journal December 2001
Multi-polymer microstereolithography for hybrid opto-MEMS
  • Maruo, S.; Ikuta, K.; Ninagawa, T.
  • Technical Digest MEMS 2001 14th IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) https://doi.org/10.1109/MEMSYS.2001.906501
conference January 2001
Procedure for Rapid Fabrication of Non-Assembly Mechanisms With Embedded Components
  • De Laurentis, Kathryn J.; Kong, Fung Felix; Mavroidis, Constantinos
  • ASME 2002 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, Volume 5: 27th Biennial Mechanisms and Robotics Conference https://doi.org/10.1115/DETC2002/MECH-34350
conference January 2002
Process Planning for Embedding Flexible Materials in Multi-Material Prototypes
  • Hatanaka, Motohide; Cutkosky, Mark R.
  • ASME 2003 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, Volume 3a: 8th Design for Manufacturing Conference https://doi.org/10.1115/DETC2003/DFM-48166
conference June 2008
Cure depth in photopolymerization: Experiments and theory journal December 2001

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