Flip Chip Assembly for Cryogenics and Flexible Substrates
Conference
·
OSTI ID:1236429
Abstract Not Provided
- Research Organization:
- SLAC National Accelerator Laboratory (SLAC)
- Sponsoring Organization:
- US DOE Office of Science (DOE SC)
- DOE Contract Number:
- AC02-76SF00515
- OSTI ID:
- 1236429
- Report Number(s):
- SLAC-PUB-16429
- Country of Publication:
- United States
- Language:
- English
Similar Records
Flip Chip Assembly of Thin Substrates, Fine Bump Pitch, and Small Area Prototype Die
Flip-Chip and Backside Techniques.
Flip-Chip and Backside Techniques.
Conference
·
Sun Dec 14 23:00:00 EST 2014
·
OSTI ID:1165894
Flip-Chip and Backside Techniques.
Conference
·
Wed Aug 01 00:00:00 EDT 2018
·
OSTI ID:1581915
Flip-Chip and Backside Techniques.
Conference
·
Thu Aug 01 00:00:00 EDT 2019
·
OSTI ID:1641640