Flip Chip Assembly of Thin Substrates, Fine Bump Pitch, and Small Area Prototype Die
Conference
·
OSTI ID:1165894
Abstract Not Provided
- Research Organization:
- SLAC National Accelerator Laboratory (SLAC)
- Sponsoring Organization:
- US DOE Office of Science (DOE SC)
- DOE Contract Number:
- AC02-76SF00515
- OSTI ID:
- 1165894
- Report Number(s):
- SLAC-PUB-16168
- Country of Publication:
- United States
- Language:
- English
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