Flip-Chip and Backside Techniques.
Conference
·
OSTI ID:1641640
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1641640
- Report Number(s):
- SAND2019-9504C; 678471
- Resource Relation:
- Conference: Proposed for presentation at the International Symposium for Testing and Failure Analysis (ISTFA) held November 9-14, 2019 in Portland, OR.
- Country of Publication:
- United States
- Language:
- English
Similar Records
Flip-Chip and Backside Techniques Seminar ISTFA '09.
Flip-Chip and Backside Techniques Seminar ISTFA'07.
Flip-Chip and Backside Techniques.
Conference
·
Sat Aug 01 00:00:00 EDT 2009
·
OSTI ID:1641640
Flip-Chip and Backside Techniques Seminar ISTFA'07.
Conference
·
Mon Oct 01 00:00:00 EDT 2007
·
OSTI ID:1641640
Flip-Chip and Backside Techniques.
Conference
·
Wed Aug 01 00:00:00 EDT 2018
·
OSTI ID:1641640