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Title: Integrated Double Sided Cooling Packaging of Planar SiC Power Modules-Final paper

Conference ·
OSTI ID:1222561

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
DOE Contract Number:
DE-AC05-00OR22725
OSTI ID:
1222561
Resource Relation:
Conference: The Seventh Annual IEEE Energy Conversion Congress & Exposition (ECCE 2015), Montreal, Canada, 20150920, 20150920
Country of Publication:
United States
Language:
English

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