Solder Interconnect Predictor (SIP) Software Package.
Conference
·
OSTI ID:1157550
Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Albuquerque, NM
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1157550
- Report Number(s):
- SAND2007-1866C; 523652
- Country of Publication:
- United States
- Language:
- English
Similar Records
Solder Interconnect Predictor (SIP) Software Package.
Solder interconnect predictor (SIP) software package.
Solder Interconnect Predictor (SIP) Solder Fatigue Software.
Conference
·
Sat Sep 01 00:00:00 EDT 2007
·
OSTI ID:1716681
Solder interconnect predictor (SIP) software package.
Conference
·
Sun Oct 31 23:00:00 EST 2004
·
OSTI ID:964582
Solder Interconnect Predictor (SIP) Solder Fatigue Software.
Conference
·
Wed Oct 01 00:00:00 EDT 2008
·
OSTI ID:1142781