Solder interconnect predictor (SIP) software package.

Conference · Sun Oct 31 23:00:00 EST 2004

OSTI ID:964582

Neilsen, Michael K; Vianco, Paul Thomas; Fossum, Arlo Frederick; Burchett, Steven N; Holm, Elizabeth Ann; Wirthlin, R ^[1]; Clifford, T ^[2]

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1. Strikewire Technologies Louisville, CO
2. Lockheed Martin Missiles and Space Company Sunnyvale, CA

No abstract prepared.

• Research Organization: Sandia National Laboratories
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 964582
• Report Number(s): SAND2004-5987C
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
FORECASTING
METALLURGICAL FLUX
MICROELECTRONIC CIRCUITS
S CODES
SERVICE LIFE
SOLDERED JOINTS