Method of manufacturing a fully integrated and encapsulated micro-fabricated vacuum diode
Patent
·
OSTI ID:1151787
Disclosed is an encapsulated micro-diode and a method for producing same. The method comprises forming a plurality columns in the substrate with a respective tip disposed at a first end of the column, the tip defining a cathode of the diode; disposing a sacrificial oxide layer on the substrate, plurality of columns and respective tips; forming respective trenches in the sacrificial oxide layer around the columns; forming an opening in the sacrificial oxide layer to expose a portion of the tips; depositing a conductive material in of the opening and on a surface of the substrate to form an anode of the diode; and removing the sacrificial oxide layer.
- Research Organization:
- SNL-A (Sandia National Laboratories, Albuquerque, NM (United States))
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- 8,814,622
- Application Number:
- 13/298,448
- OSTI ID:
- 1151787
- Country of Publication:
- United States
- Language:
- English
An integrated field emission array for ion desorption
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journal | May 2010 |
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