Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment.

Conference ·
OSTI ID:1141164

Abstract not provided.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1141164
Report Number(s):
SAND2011-3519C; 506086
Country of Publication:
United States
Language:
English

Similar Records

A New Wafer-Level Packaging Technology for MEMS with Hermetic Micro-Environment.
Conference · Mon Jan 31 23:00:00 EST 2011 · OSTI ID:1120857

Hermetic Wafer-Level Packaging for RF MEMs: Effects on Resonator Performance.
Conference · Tue May 01 00:00:00 EDT 2012 · OSTI ID:1117248

Hermetic Wafer-Level Packaging for RF MEMs: Effects on Resonator Performance.
Conference · Tue Jan 31 23:00:00 EST 2012 · OSTI ID:1118145

Related Subjects