Generalized Procedure for Improved Accuracy of Thermal Contact Resistance Measurements for Materials With Arbitrary Temperature-Dependent Thermal Conductivity

Sayer, Robert A.

doi:10.1080/01457632.2014.932553

Generalized Procedure for Improved Accuracy of Thermal Contact Resistance Measurements for Materials With Arbitrary Temperature-Dependent Thermal Conductivity

Journal Article · Thu Jun 26 00:00:00 EDT 2014 · Heat Transfer Engineering

DOI:https://doi.org/10.1080/01457632.2014.932553· OSTI ID:1140522

Sayer, Robert A. ^[1]

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Thermal contact resistance (TCR) is most commonly measured using one-dimensional steady-state calorimetric techniques. In the experimental methods we utilized, a temperature gradient is applied across two contacting beams and the temperature drop at the interface is inferred from the temperature profiles of the rods that are measured at discrete points. During data analysis, thermal conductivity of the beams is typically taken to be an average value over the temperature range imposed during the experiment. Our generalized theory is presented and accounts for temperature-dependent changes in thermal conductivity. The procedure presented enables accurate measurement of TCR for contacting materials whose thermal conductivity is any arbitrary function of temperature. For example, it is shown that the standard technique yields TCR values that are about 15% below the actual value for two specific examples of copper and silicon contacts. Conversely, the generalized technique predicts TCR values that are within 1% of the actual value. The method is exact when thermal conductivity is known exactly and no other errors are introduced to the system.

View Accepted Manuscript (DOE)

Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: AC04-94AL85000

OSTI ID:: 1140522

Report Number(s):: SAND--2014-0138J; 493282

Journal Information:: Heat Transfer Engineering, Journal Name: Heat Transfer Engineering Journal Issue: 5 Vol. 36; ISSN 0145-7632

Publisher:: Taylor & FrancisCopyright Statement

Country of Publication:: United States

Language:: English

References (32)

Experimental Aspects Chang, Albert M. The Quantum Hall Effect https://doi.org/10.1007/978-1-4612-3350-3_6	book	January 1990
Experimental Aspects Madhusudana, C. V. Thermal Contact Conductance https://doi.org/10.1007/978-1-4612-3978-9_5	book	January 1996
Experimental Aspects Aynajian, Pegor Electron-Phonon Interaction in Conventional and Unconventional Superconductors https://doi.org/10.1007/978-3-642-14968-9_6	book	January 2011
Experimental Aspects Aliev, Yuri M.; Schüter, Hans; Shivarova, Antonia Guided-Wave-Produced Plasmas https://doi.org/10.1007/978-3-642-57060-5_7	book	January 2000
Interfacial thermal contact resistance between aluminum nitride and copper at cryogenic temperature Shi, Ling; Wu, Gang; Wang, Hui-ling Heat and Mass Transfer, Vol. 48, Issue 6 https://doi.org/10.1007/s00231-011-0953-y	journal	December 2011
Role of thermal boundary resistance on the heat flow in carbon-nanotube composites Shenogin, Sergei; Xue, Liping; Ozisik, Rahmi Journal of Applied Physics, Vol. 95, Issue 12 https://doi.org/10.1063/1.1736328	journal	June 2004
Interface effect on thermal conductivity of carbon nanotube composites Nan, Ce-Wen; Liu, Gang; Lin, Yuanhua Applied Physics Letters, Vol. 85, Issue 16 https://doi.org/10.1063/1.1808874	journal	October 2004
Thermal Conductivity of the Elements Ho, C. Y.; Powell, R. W.; Liley, P. E. Journal of Physical and Chemical Reference Data, Vol. 1, Issue 2 https://doi.org/10.1063/1.3253100	journal	April 1972
Modified data analysis for thermal conductivity measurements of polycrystalline silicon microbridges using a steady state Joule heating technique Sayer, Robert A.; Piekos, Edward S.; Phinney, Leslie M. Review of Scientific Instruments, Vol. 83, Issue 12 https://doi.org/10.1063/1.4769059	journal	December 2012
Development of Estimation Procedure of Contact Heat Transfer Coefficient at the Part–Tool Interface in Hot Stamping Process Abdulhay, Bakri; Bourouga, Brahim; Dessain, Christine Heat Transfer Engineering, Vol. 32, Issue 6 https://doi.org/10.1080/01457632.2010.506362	journal	May 2011
Thermal Analysis of Orthotropic Pin Fins With Contact Resistance: A Closed-Form Analytical Solution Zubair, Syed M.; Mustafa, M. Tahir; Arif, Abul Fazal M. Heat Transfer Engineering, Vol. 34, Issue 4 https://doi.org/10.1080/01457632.2013.716352	journal	October 2012
Experimental Investigation of Contact Heat Transfer at High Temperature Based on Steady-State Heat Flux Method Xing, L.; Zhang, L. W.; Zhang, X. Z. Experimental Heat Transfer, Vol. 23, Issue 2 https://doi.org/10.1080/08916150903402773	journal	March 2010
Thermal Conductivity of Silicon and Germanium from 3°K to the Melting Point Glassbrenner, C. J.; Slack, Glen A. Physical Review, Vol. 134, Issue 4A https://doi.org/10.1103/PhysRev.134.A1058	journal	May 1964
Thermal Conductivity and Specific Heat of Noncrystalline Solids Zeller, R. C.; Pohl, R. O. Physical Review B, Vol. 4, Issue 6 https://doi.org/10.1103/PhysRevB.4.2029	journal	September 1971
Interface Thermal Resistance between Dissimilar Anharmonic Lattices Li, Baowen; Lan, Jinghua; Wang, Lei Physical Review Letters, Vol. 95, Issue 10 https://doi.org/10.1103/PhysRevLett.95.104302	journal	September 2005
Colloquium : Phononics: Manipulating heat flow with electronic analogs and beyond Li, Nianbei; Ren, Jie; Wang, Lei Reviews of Modern Physics, Vol. 84, Issue 3 https://doi.org/10.1103/RevModPhys.84.1045	journal	July 2012
Thermal Conductivity of Silicon and Germanium from 3°K to the Melting Point Glassbrenner, C. J.; Slack, Glen A. Physical Review, Vol. 134, Issue 4A https://doi.org/10.1103/physrev.134.a1058	journal	May 1964
Thermal Conductivity and Specific Heat of Noncrystalline Solids Zeller, R. C.; Pohl, R. O. Physical Review B, Vol. 4, Issue 6 https://doi.org/10.1103/physrevb.4.2029	journal	September 1971
Interface Thermal Resistance between Dissimilar Anharmonic Lattices Li, Baowen; Lan, Jinghua; Wang, Lei Physical Review Letters, Vol. 95, Issue 10 https://doi.org/10.1103/physrevlett.95.104302	journal	September 2005
Colloquium : Phononics: Manipulating heat flow with electronic analogs and beyond Li, Nianbei; Ren, Jie; Wang, Lei Reviews of Modern Physics, Vol. 84, Issue 3 https://doi.org/10.1103/revmodphys.84.1045	journal	July 2012
Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces Hodson, Stephen L.; Bhuvana, Thiruvelu; Cola, Baratunde A. Journal of Electronic Packaging, Vol. 133, Issue 2 https://doi.org/10.1115/1.4004094	journal	June 2011
Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique Wasniewski, Joseph R.; Altman, David H.; Hodson, Stephen L. Journal of Electronic Packaging, Vol. 134, Issue 2 https://doi.org/10.1115/1.4005909	journal	June 2012
Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique Wasniewski, Joseph R.; Altman, David H.; Hodson, Stephen L. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 https://doi.org/10.1115/ipack2011-52148	conference	February 2012
Thermal Contact Conductance at Low Contact Pressures Milanez, Fernando H.; Yovanovich, Michael M.; Mantelli, Marcia B. H. Journal of Thermophysics and Heat Transfer, Vol. 18, Issue 1 https://doi.org/10.2514/1.2259	journal	January 2004
Predicting thermal contact resistance at cryogenic temperatures for spacecraft applications Maddren, J.; Marschall, E. Journal of Spacecraft and Rockets, Vol. 32, Issue 3 https://doi.org/10.2514/3.26639	journal	May 1995
Heat transfer enhancement techniques for Space Station cold plates Peterson, G. P.; Fletcher, L. S. Journal of Thermophysics and Heat Transfer, Vol. 5, Issue 3 https://doi.org/10.2514/3.280	journal	July 1991
Heat transfer enhancement techniques for Space Station cold plates Peterson, G.; Fletcher, L. 28th Aerospace Sciences Meeting https://doi.org/10.2514/6.1990-541	conference	August 1990
Predicting thermal contact resistance at cryogenic temperatures for spacecraft applications Maddren, J.; Marschall, E. 28th Thermophysics Conference https://doi.org/10.2514/6.1993-2775	conference	August 1993
Thermal Contact Conductance at Low Contact Pressures Milanez, Fernando; Yovanovich, Michael; Mantelli, Marcia 36th AIAA Thermophysics Conference https://doi.org/10.2514/6.2003-3489	conference	June 2003
Performance Evaluation of Thermal Interface Material for Space Applications Gandhi, Jigar; Pathak, A. V. Applied Mechanics and Materials, Vol. 110-116 https://doi.org/10.4028/www.scientific.net/AMM.110-116.135	journal	October 2011
Performance Evaluation of Thermal Interface Material for Space Applications Gandhi, Jigar; Pathak, A. V. Applied Mechanics and Materials, Vol. 110-116 https://doi.org/10.4028/www.scientific.net/amm.110-116.135	journal	October 2011
Interface thermal resistance between dissimilar anharmonic lattice Li, Baowen; Lan, Jing-Hua; Wang, Lei arXiv https://doi.org/10.48550/arxiv.cond-mat/0509133	text	January 2005

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