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On the Strain Rate- and Temperature-Dependent Tensile Behavior of eutectic Sn-Pb solder.

Journal Article · Wed Sep 01 00:00:00 EDT 2010 · Journal of Electronic Packaging

OSTI ID:1122168

Boyce, Brad Lee; Neilsen, Michael K. ^[1]; Brewer, Luke N.; Perricone, Matthew J.

Sandia National Laboratories, Kansas City, MO

Abstract not provided.

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Research Organization:: Sandia National Laboratories Kansas City, MO; Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 1122168

Report Number(s):: SAND2010-6236J; 491330

Journal Information:: Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging

Country of Publication:: United States

Language:: English

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