Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder.

Journal Article · Wed May 01 00:00:00 EDT 2013 · Solder and Surface Mount Technology

OSTI ID:1145406

Rejent, Jerome Andrew; Kilgo, Alice C.; Garrett, Stephen E.; Vianco, Paul Thomas

Abstract not provided.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: DE-AC04-94AL85000
• OSTI ID: 1145406
• Report Number(s): SAND2013-4173J; 453182
• Journal Information: Solder and Surface Mount Technology, Related Information: Proposed for publication in Solder and Surface Mount Technology.
• Country of Publication: United States
• Language: English