Skip to main content
OSTI.GOVU.S. Department of Energy Office of Scientific and Technical Information
U.S. Department of Energy
Office of Scientific and Technical Information
 

Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder.

Journal Article · · Solder and Surface Mount Technology
OSTI ID:1145406
; ; ;
Abstract not provided.
Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1145406
Report Number(s):
SAND2013-4173J; 453182
Journal Information:
Solder and Surface Mount Technology, Journal Name: Solder and Surface Mount Technology
Country of Publication:
United States
Language:
English

Similar Records

SENSITIVITY OF COPPER DISSOLUTION TO THE FLOW BEHAVIOR OF MOLTEN SN-PB SOLDER.
Conference · Tue Jul 01 00:00:00 EDT 2014 · OSTI ID:1315661
Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder.
Conference · Mon Sep 01 00:00:00 EDT 2014 · OSTI ID:1576086
Creep Behavior of a Sn-Ag-Bi Pb-free Solder.
Journal Article · Sun Jul 01 00:00:00 EDT 2012 · Proposed for publication in Materials. · OSTI ID:1073238

Related Subjects