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Creep Behavior of a Sn-Ag-Bi Pb-free Solder.

Journal Article · · Proposed for publication in Materials.
DOI:https://doi.org/10.3390/ma5112151· OSTI ID:1073238
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Abstract Not Provided

Research Organization:
Sandia National Laboratories
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1073238
Report Number(s):
SAND2012-5878J
Journal Information:
Proposed for publication in Materials., Journal Name: Proposed for publication in Materials. Journal Issue: 12 Vol. 5; ISSN 1996-1944
Country of Publication:
United States
Language:
English

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