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Title: Maintainable substrate carrier for electroplating

Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

Inventors:
 [1];  [2];  [3];  [2];  [2];  [4]; ;  [5]
  1. Milpitas, CA
  2. Laguna, PH
  3. Cavite, PH
  4. Batangas, PH
  5. Saratoga, CA
Publication Date:
Research Org.:
SunPower Corporation (San Jose, CA)
Sponsoring Org.:
USDOE
OSTI Identifier:
1068843
Patent Number(s):
8,221,601
Application Number:
12/889,232
Assignee:
SunPower Corporation (San Jose, CA) GFO
DOE Contract Number:  
FC36-07GO17043
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chen, Chen-An, Abas, Emmanuel Chua, Divino, Edmundo Anida, Ermita, Jake Randal G, Capulong, Jose Francisco S, Castillo, Arnold Villamor, Ma,, and Xiaobing, Diana. Maintainable substrate carrier for electroplating. United States: N. p., 2012. Web.
Chen, Chen-An, Abas, Emmanuel Chua, Divino, Edmundo Anida, Ermita, Jake Randal G, Capulong, Jose Francisco S, Castillo, Arnold Villamor, Ma,, & Xiaobing, Diana. Maintainable substrate carrier for electroplating. United States.
Chen, Chen-An, Abas, Emmanuel Chua, Divino, Edmundo Anida, Ermita, Jake Randal G, Capulong, Jose Francisco S, Castillo, Arnold Villamor, Ma,, and Xiaobing, Diana. Tue . "Maintainable substrate carrier for electroplating". United States. https://www.osti.gov/servlets/purl/1068843.
@article{osti_1068843,
title = {Maintainable substrate carrier for electroplating},
author = {Chen, Chen-An and Abas, Emmanuel Chua and Divino, Edmundo Anida and Ermita, Jake Randal G and Capulong, Jose Francisco S and Castillo, Arnold Villamor and Ma, and Xiaobing, Diana},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 17 00:00:00 EDT 2012},
month = {Tue Jul 17 00:00:00 EDT 2012}
}

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