Maintainable substrate carrier for electroplating

Patent · Tue Jul 17 00:00:00 EDT 2012

OSTI ID:1068843

Chen, Chen-An ^[1]; Abas, Emmanuel Chua ^[2]; Divino, Edmundo Anida ^[3]; Ermita, Jake Randal G ^[2]; Capulong, Jose Francisco S ^[2]; Castillo, Arnold Villamor ^[4]; Ma,; Xiaobing, Diana ^[5]

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1. Milpitas, CA
2. Laguna, PH
3. Cavite, PH
4. Batangas, PH
5. Saratoga, CA

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

• Research Organization: SunPower Corporation (San Jose, CA)
• Sponsoring Organization: USDOE
• DOE Contract Number: FC36-07GO17043
• Assignee: SunPower Corporation (San Jose, CA)
• Patent Number(s): 8,221,601
• Application Number: 12/889,232
• OSTI ID: 1068843
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING