Evolution of stress failure resulting from high-temperature stress-corrosion cracking in a hot isostatically pressed silicon nitride
Journal Article
·
· Journal of the American Ceramic Society
- Oak Ridge National Lab., TN (United States). High Temperature Materials Lab.
- Saint-Gobain/Norton Industrial Ceramics Corporation, Northboro, MA (United States)
Stress-corrosion cracking in a commercially available, hot isostatically pressed (HIPed), yttria-fluxed, silicon nitride was the prevalent mode of failure in specimens creep-ruptured at 1,370 C. High-temperature diffusional processes associated with oxygen were responsible for the creation of an advancing stress-corrosion front that had formed at the specimen surface and advanced radially inward. The volume of material in the wake of the stress-corrosion front possessed a high concentration of lenticular cavities at two-grain boundaries, a high concentration of multigrain junction cavities, and large amorphous ``pockets`` in other multigrain junctions that were abnormally rich in oxygen and yttrium. The combination of tensile stress and the high concentration of cavities in the near-surface volume of the material resulted in microcrack coalescence or the formation of a planar, stress-corrosion crack. The concurrent growth of the stress-corrosion front and crack during the tensile creep-rupture tests ultimately led to stress-induced failure.
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-84OR21400
- OSTI ID:
- 106007
- Journal Information:
- Journal of the American Ceramic Society, Journal Name: Journal of the American Ceramic Society Journal Issue: 8 Vol. 78; ISSN 0002-7820; ISSN JACTAW
- Country of Publication:
- United States
- Language:
- English
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