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Evolution of stress failure resulting from high-temperature stress-corrosion cracking in a hot isostatically pressed silicon nitride

Journal Article · · Journal of the American Ceramic Society
; ; ;  [1]; ;  [2]
  1. Oak Ridge National Lab., TN (United States). High Temperature Materials Lab.
  2. Saint-Gobain/Norton Industrial Ceramics Corporation, Northboro, MA (United States)
Stress-corrosion cracking in a commercially available, hot isostatically pressed (HIPed), yttria-fluxed, silicon nitride was the prevalent mode of failure in specimens creep-ruptured at 1,370 C. High-temperature diffusional processes associated with oxygen were responsible for the creation of an advancing stress-corrosion front that had formed at the specimen surface and advanced radially inward. The volume of material in the wake of the stress-corrosion front possessed a high concentration of lenticular cavities at two-grain boundaries, a high concentration of multigrain junction cavities, and large amorphous ``pockets`` in other multigrain junctions that were abnormally rich in oxygen and yttrium. The combination of tensile stress and the high concentration of cavities in the near-surface volume of the material resulted in microcrack coalescence or the formation of a planar, stress-corrosion crack. The concurrent growth of the stress-corrosion front and crack during the tensile creep-rupture tests ultimately led to stress-induced failure.
Sponsoring Organization:
USDOE
DOE Contract Number:
AC05-84OR21400
OSTI ID:
106007
Journal Information:
Journal of the American Ceramic Society, Journal Name: Journal of the American Ceramic Society Journal Issue: 8 Vol. 78; ISSN 0002-7820; ISSN JACTAW
Country of Publication:
United States
Language:
English

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