Creep and stress rupture behavior of an advanced silicon nitride; Part 1: Experimental observations

Journal Article · Sun May 01 04:00:00 EDT 1994 · Journal of the American Ceramic Society; (United States)

DOI:https://doi.org/10.1111/j.1151-2916.1994.tb05395.x· OSTI ID:7236448

Menon, M N; Fang, H T; Wu, D C ^[1]; Jenkins, M G ^[2]; Ferber, M K; More, K L; Hubbard, C R; Nolan, T A ^[3]

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1. AlliedSignal Aerospace Co., Phoenix, AZ (United States). AlliedSignal Engines
2. Univ. of Washington, Seattle, WA (United States). Dept. of Mechanical Engineering
3. Oak Ridge National Lab., TN (United States). High Temperature Materials Lab.

Cylindrical buttonhead specimens of an advanced silicon nitride were tested in uniaxial tension at temperatures between 1,422 and 1,673 K. In the range 1,477 to 1,673 K, creep deformation was reliably measured using high-temperature contact probe extensometry. Extensive scanning and transmission electron microscopy has revealed the formation of lenticular cavities at two-grain junctions at all temperatures (1,422--1,673 K) and extensive triple-junction cavitation occurring at the higher temperatures (1,644--1,673 K). Cavitation is believed to be part of the net creep process. The stress rupture data show stratification of the Monkman-Grant lines with respect to temperature. Failure strain increased with increase in rupture time or temperature, or decrease in stress. Fractography showed that final failure occurred by subcritical crack growth in all specimens.

• DOE Contract Number: AC05-84OR21400
• OSTI ID: 7236448
• Journal Information: Journal of the American Ceramic Society; (United States), Journal Name: Journal of the American Ceramic Society; (United States) Vol. 77:5; ISSN 0002-7820; ISSN JACTAW
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360203* -- Ceramics
Cermets
& Refractories-- Mechanical Properties
CRACK PROPAGATION
CREEP
DATA
EXPERIMENTAL DATA
FAILURES
INFORMATION
MATERIALS TESTING
MECHANICAL PROPERTIES
MECHANICAL TESTS
MICROSTRUCTURE
NITRIDES
NITROGEN COMPOUNDS
NUMERICAL DATA
PNICTIDES
RUPTURES
SILICON COMPOUNDS
SILICON NITRIDES
TEMPERATURE DEPENDENCE
TESTING