Creep and stress rupture behavior of an advanced silicon nitride; Part 2: Creep rate behavior

Journal Article · Sun May 01 04:00:00 EDT 1994 · Journal of the American Ceramic Society; (United States)

DOI:https://doi.org/10.1111/j.1151-2916.1994.tb05396.x· OSTI ID:7303136

Menon, M N; Fang, H T; Wu, D C ^[1]; Jenkins, M G ^[2]; Ferber, M K ^[3]

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1. AlliedSignal Aerospace Co., Phoenix, AZ (United States). AlliedSignal Engines
2. Univ. of Washington, Seattle, WA (United States). Dept. of Mechanical Engineering
3. Oak Ridge National Lab., TN (United States). High Temperature Materials Lab.

In Part 1 of this paper, experimental observations on creep testing of 74 tensile specimens of an advanced silicon nitride were presented. In this part, equations are developed for predicting creep rates in the primary and secondary regimes in the temperature range 1,477--1,673 K. The resulting model predicts creep strain rates to within a factor of two. The underlying phenomenological basis, which employs an activation energy approach, is discussed. The mechanisms that are likely to be responsible for the transiency of the primary creep regime and for the unique stress and temperature dependencies of the creep rates are explored.

• DOE Contract Number: AC05-84OR21400
• OSTI ID: 7303136
• Journal Information: Journal of the American Ceramic Society; (United States), Journal Name: Journal of the American Ceramic Society; (United States) Vol. 77:5; ISSN 0002-7820; ISSN JACTAW
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360203* -- Ceramics
Cermets
& Refractories-- Mechanical Properties
ACTIVATION ENERGY
CREEP
ENERGY
MATHEMATICAL MODELS
MECHANICAL PROPERTIES
NITRIDES
NITROGEN COMPOUNDS
PNICTIDES
SILICON COMPOUNDS
SILICON NITRIDES
STRAIN RATE