Laser patterning of laminated structures for electroplating

Patent Application · Thu Dec 31 00:00:00 EST 1992

OSTI ID:10171135

Mayer, S T; Evans, L B

Disclosed is a process for laser patterning of a substrate so that it can be subsequently electroplated or electrolessly plated. The process utilizes a laser to treat an inactive (inert) layer formed over an active layer to either combine or remove the inactive layer to produce a patterned active layer on which electrodeposition can occur. The process is carried out by utilizing laser alloying and laser etching, and involves only a few relatively high yield steps and can be performed on a very small scale.

• Research Organization: Lawrence Livermore National Lab., CA (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: Dept. of Energy
• Patent Number(s): PATENTS-US-A7941838
• Application Number: ON: DE94016102; PAN: 7-941,838
• OSTI ID: 10171135
• Resource Relation: Other Information: PBD: 1992
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
ELECTRONIC CIRCUITS
FABRICATION
METALS
ELECTRODEPOSITION
INTEGRATED CIRCUITS
CONNECTORS
SUBSTRATES
ELECTROPLATING
LASER RADIATION
ETCHING
426000
COMPONENTS
ELECTRON DEVICES AND CIRCUITS