Evaluation of overflow wet rinsing efficiency

Conference · Fri Jul 01 00:00:00 EDT 1994

OSTI ID:10166258

Kempka, S N; Torczynski, J R; Geller, A S ^[1]; Rosato, J J; Walters, R N ^[2]; Sibbett, S S ^[3]

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1. Sandia National Labs., Albuquerque, NM (United States)
2. Santa Clara Plastics, Boise, ID (United States)
3. Intel Corp., Rio Rancho, NM (United States)

A description of the flow field in an overflow wafer rinse process is presented. This information is being used in an initiative whose principal objective is to reduce the usage of water in wafer rinsing. The velocity field is calculated using finite-element numerical techniques. A large portion of the water does not contribute to wafer rinsing.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 10166258
• Report Number(s): SAND--94-1700C; CONF-9410132--3; ON: DE94015019; BR: GB0103012
• Country of Publication: United States
• Language: English

Related Subjects

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
320303
42 ENGINEERING
426000
54 ENVIRONMENTAL SCIENCES
540320
CHEMICALS MONITORING AND TRANSPORT
COMPONENTS
ELECTRON DEVICES AND CIRCUITS
EQUIPMENT AND PROCESSES
FLUID FLOW
INTEGRATED CIRCUITS
RESOURCE CONSERVATION
SURFACE CLEANING
WASTE WATER
WATER
WATER RESOURCES