Diamond: A new high thermal conductivity substrate for multichip modules and hybrid circuits
As applications for hybrid circuits and multichip modules create demand for higher density circuits and higher power components, new substrate materials are required to deal with the heat generated on the circuit. Sandia National Laboratories is developing diamond substrate technology to meet the requirements of high thermal conductivity. Thin film processes were developed and characterized to delineate conductor-resistor networks on free standing diamond substrates having fine line gold conductors and low and high sheet resistivity resistors. Thin film hybrid circuit technology was developed on CVD-processed, polycrystalline diamond substrates having as-deposited surface finishes as well as those with polished surfaces. Conductors were defined by pattern plating gold and resistors were processed from sputtered tantalum nitride films which were deposited to sheet resistivities of 5 and/or 100 ohms per square. Resistor films on diamond substrates were evaluated for Temperature Coefficient of Resistance (TCR), stability with time and temperature, and trimmability using YAG laser processing. Plated gold conductors were patterned on diamond to feature sizes of 25 microns and successfully tested for adhesion and bondability. Advanced YAG laser trimming techniques were developed to allow resistor trims on both low and high value resistors to within 1% of desip value while maintaining required resistor stability, new trim techniques were needed to offset the carbonization of diamond in the laser trim area. Reliability studies were carried out on the diamond thin film networks which showed them to compare favorably with the same thin film technology on alumina substrates.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 10134836
- Report Number(s):
- SAND-92-2476C; CONF-9306104-2; ON: DE93008337
- Resource Relation:
- Conference: 43. electronic component and technology conference,Orlando, FL (United States),1-3 Jun 1993; Other Information: PBD: [1992]
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
DIAMONDS
CHEMICAL VAPOR DEPOSITION
INTEGRATED CIRCUITS
THERMAL CONDUCTIVITY
SUBSTRATES
LASERS
THIN FILMS
MICROELECTRONICS
426000
665300
COMPONENTS
ELECTRON DEVICES AND CIRCUITS
INTERACTIONS BETWEEN BEAMS AND CONDENSED MATTER