New multiple sheet resistance technology for thin film circuits

Conference · Tue Jan 01 00:00:00 EST 1985

OSTI ID:5156944

Norwood, D

A process has been developed to obtain thin film circuits having multiple sheet resistances for resistors. With additional levels of photoprocessing, the conductor underlayers of titanium and palladium can be processed into resistors having sheet resistivities of 1 and 10 ohms per square. This technology does not require changes to the standard metallization processes and conventional tantalum-nitride (Ta/sub 2/N) resistor processing remains the same. The titanium-palladium resistors evaluated in this study are stable, well-behaved resistors having a large power dissipation capability; they can be laser trimmed to close tolerances. However, the higher Temperature Coefficient of Resistance (TRC) does limit their use in some circuit applications.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 5156944
• Report Number(s): SAND-85-0458C; CONF-851175-1; ON: DE85016459
• Resource Relation: Conference: International symposium on microelectronics, Anaheim, CA, USA, 11 Nov 1985
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
INTEGRATED CIRCUITS
ETCHING
RESISTORS
THIN FILMS
DESIGN
PALLADIUM
PHOTOCHEMICAL REACTIONS
TANTALUM NITRATES
TEMPERATURE EFFECTS
TITANIUM
CHEMICAL REACTIONS
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
FILMS
METALS
MICROELECTRONIC CIRCUITS
NITRATES
NITROGEN COMPOUNDS
OXYGEN COMPOUNDS
PLATINUM METALS
REFRACTORY METAL COMPOUNDS
SURFACE FINISHING
TANTALUM COMPOUNDS
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS
420800* - Engineering- Electronic Circuits & Devices- (-1989)