New multiple sheet resistance technology for thin film circuits
A process has been developed to obtain thin film circuits having multiple sheet resistances for resistors. With additional levels of photoprocessing, the conductor underlayers of titanium and palladium can be processed into resistors having sheet resistivities of 1 and 10 ohms per square. This technology does not require changes to the standard metallization processes and conventional tantalum-nitride (Ta/sub 2/N) resistor processing remains the same. The titanium-palladium resistors evaluated in this study are stable, well-behaved resistors having a large power dissipation capability; they can be laser trimmed to close tolerances. However, the higher Temperature Coefficient of Resistance (TRC) does limit their use in some circuit applications.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 5156944
- Report Number(s):
- SAND-85-0458C; CONF-851175-1; ON: DE85016459
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
CHEMICAL REACTIONS
DESIGN
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
ETCHING
FILMS
INTEGRATED CIRCUITS
METALS
MICROELECTRONIC CIRCUITS
NITRATES
NITROGEN COMPOUNDS
OXYGEN COMPOUNDS
PALLADIUM
PHOTOCHEMICAL REACTIONS
PLATINUM METALS
REFRACTORY METAL COMPOUNDS
RESISTORS
SURFACE FINISHING
TANTALUM COMPOUNDS
TANTALUM NITRATES
TEMPERATURE EFFECTS
THIN FILMS
TITANIUM
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS