Low thermal resistance power module assembly

Patent · Tue Mar 13 00:00:00 EDT 2007

OSTI ID:1007934

Hassani, Vahab ^[1]; Vlahinos, Andreas ^[2]; Bharathan, Desikan ^[3]

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1. Denver, CO
2. Castle Rock, CO
3. Arvada, CO

A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.

• Research Organization: National Renewable Energy Laboratory (NREL), Golden, CO (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC36-99GO10337
• Assignee: Midwest Research Institute (Kansas City, MO)
• Patent Number(s): 7,190,581
• Application Number: 11/032,771
• OSTI ID: 1007934
• Country of Publication: United States
• Language: English